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DATA SHEET
GaAs INTEGRATED CIRCUIT
PPG152TA
L-BAND SPDT SWITCH
DESCRIPTION
The PPG152TA is an L-band SPDT (Single Pole Double Throw) GaAs FET switch which was developed for digital cellular or cordless telephone application. insertion loss. It housed in as original 6 pin mini-mold that is smaller than usual 8 pin SSOP and easy to install and contributes to miniaturizing the system. It can be used in wide-band switching applications. The device can operate from 100 MHz to 2.5 GHz, having the low
FEATURES
* Low insertion loss * Small 6 pin mini-mold : LINS = 0.6 dB typ. @ f = 2 GHz * High power switching : Pin (1 dB) = +30 dBm typ. @ VCONT = +3.0 V/0 V, f = 2 GHz
APPLICATION
* Digital cordless telephone : PHS, DECT, PCS etc. * Digital hand-held cellular phone: PDC Antenna diversity etc.
ORDERING INFORMATION
PART NUMBER PACKAGE 6 pins Mini-mold PACKING FORM Carrier tape width 8 mm, 1 pin faces toward the open end of the tape, 3000 pcs/Reel
PPG152TA-E3
Remark
For evaluation sample order, please contact your local NEC sales office. (Part number for sample order: PPG152TA)
ABSOLUTE MAXIMUM RATINGS (TA = 25 C)
PARAMETERS Control Voltage 1, 2 Input Power Total Power Dissipation Operating Temperature Storage Temperature SYMBOL VCONT1, 2 Pin Ptot TA Tstg RATING 6.0 to +6.0 +31 0.4 50 to +80 65 to +150
Note
UNIT V dBm W C C
Note Condition 2.7 d | VCONT1 - VCONT 2 | d 6.0 V Caution The IC must be handled with care to prevent static discharge because its circuit is composed of GaAs MES FET.
Document No. P12398EJ2V1DS00 (2nd edition) Date Published January 1998 N CP(K) Printed in Japan
(c)
1996
PPG152TA
PIN CONNECTION DIAGRAM
(Top View) (Bottom View) 4 5 6 4 5 6 3 2 1
PIN No. 1 2 3
CONNECTION OUT1 GND OUT2
PIN No. 4 5 6
CONNECTION VCONT 2 IN VCONT 1
3 2 1
RECOMMENDED OPERATING CONDITIONS (TA = 25 C)
PARAMETERS Control Voltage (OFF) Control Voltage (ON) Input Power (VCONT = 3 V/0 V) SYMBOL VCONT VCONT Pin MIN. +2.7 0.2 TYP. +3.0 0 +27 MAX. +5.3 +0.2 +29 UNIT V V dBm
ELECTRICAL CHARACTERISTICS (Unless otherwise specified, TA = 25 C, VCONT1 = 3 V, VCONT2 = 0 V or VCONT1 = 0 V, VCONT2 = 3 V, Off chip DC blocking capacitors value; 51 pF)
CHARACTERISTICS Insertion Loss SYMBOL LINS TEST CONDITIONS f = 100 M to 2 GHz f = 2.5 GHz Isolation ISL f = 100 M to 2 GHz f = 2.5 GHz Input Return Loss Output Return Loss Input Power at 1 dB Note 2 Compression Point Switching Speed Control Current RIin RIout Pin(1 dB) f = 100 M to 2 GHz f = 100 M to 2 GHz f = 1 GHz to 2 GHz 20 20
Note 1
MIN.
TYP. 0.6 0.8
Note 1
MAX. 1.0
UNIT dB
22
dB
11 11 27 30
dB dB dBm
tsw ICONT VCONT = 3 V/0 V RF None
30 5
ns
PA
Notes 1 Characteristic for reference at 2.0 to 2.5 GHz 2 Pin(1 dB) is measured the input power level when the insertion loss increase more 1 dB than that of linear range. All other characteristics are measured in linear range. 3 When the PPG152TA is used it is necessary to use DC blocking capacitors for No.1 (OUT1), No.3 (OUT2) and No.5 (IN). The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, band width, switching speed and the condition with actual board of your system. The range of recommended DC blocking capacitor value is less than 100 pF. 4 The distance between IC's GND pin and ground pattern of substrate should be as shorter as possible to avoid parasitic parameters.
2
PPG152TA
TYPICAL CHARACTERISTICS (TA = 25 C)
Note This data is including loss of the test fixture
IN-OUT1 INSERTION LOSS vs. FREQUENCY +2.0
VCONT1 = 0 V VCONT2 = +3 V Pin = 0 dBm
IN-OUT1 ISOLATION vs. FREQUENCY 0
VCONT1 = +3 V VCONT2 = 0 V Pin = 0 dBm
LINS - Insertion Loss - dB
+1.0
-10
ISL - Isolation - dB
0
-20
-1.0
-30
-2.0 -3.0 100 M 200 M f - Frequency - Hz LINS OUT1 IN 50 OUT2
-40 -50 100 M 200 M f - Frequency - Hz
500 M
1G
2G 3G
500 M
1G ISL
2G 3G
OUT1 IN 50 OUT2
IN-OUT1 INPUT RETURN LOSS vs. FREQUENCY +10
VCONT1 = 0 V VCONT2 = +3 V Pin = 0 dBm
IN-OUT1 OUTPUT RETURN LOSS vs. FREQUENCY +10
RLout - Output Return Loss - dB
VCONT1 = 0 V VCONT2 = +3 V Pin = 0 dBm
RLin - Input Return Loss - dB
0
0
-10
-10
-20
-20
-30 -40 100 M 200 M f - Frequency - Hz
-30 -40 100 M 200 M f - Frequency - Hz
500 M RLin
1G
2G 3G
500 M
1G
2G 3G RLout OUT1
OUT1 IN 50 OUT2 IN 50
OUT2
3
PPG152TA
IN-OUT2 INSERTION LOSS vs. FREQUENCY +2.0
VCONT1 = +3 V VCONT2 = 0 V Pin = 0 dBm
IN-OUT2 ISOLATION vs. FREQUENCY 0
VCONT1 = 0 V VCONT2 = +3 V Pin = 0 dBm
LINS - Insertion Loss - dB
+1.0
-10
ISL - Isolation - dB
0
-20
-1.0
-30
-2.0 -3.0 100 M 200 M f - Frequency - Hz OUT1 50 IN LINS OUT2
-40 -50 100 M 200 M f - Frequency - Hz OUT1 50 IN ISL OUT2
500 M
1G
2G 3G
500 M
1G
2G 3G
IN-OUT2 INPUT RETURN LOSS vs. FREQUENCY +10
VCONT1 = +3 V VCONT2 = 0 V Pin = 0 dBm
IN-OUT2 OUTPUT RETURN LOSS vs. FREQUENCY +10
RLout - Output Return Loss - dB
VCONT1 = +3 V VCONT2 = 0 V Pin = 0 dBm
RLin - Input Return Loss - dB
0
0
-10
-10
-20
-20
-30 -40 100 M 200 M f - Frequency - Hz
-30 -40 100 M 200 M f - Frequency - Hz OUT1 50 IN OUT2 RLout
500 M RLin
1G
2G 3G
500 M
1G
2G 3G
OUT1 50 IN OUT2
4
PPG152TA
Temperature characteristics
Temperature Characteristics of Input/Output 34
VCONT1 = +3.0 V VCONT2 = 0 V 32 f = 2 GHz Non-modulated Signal input (cw)
30
28
Pout (dBm)
26
24
TA = -50 C TA = -10 C TA = 30 C TA = 50 C TA = 90 C
22
20 18 18
20
22
24
26 28 Pin (dBm)
30
32
34
36
5
PPG152TA
TEST CIRCUIT
TA = 25 C, VCONT1 = +3 V, VCONT2 = 0 V or VCONT1 = 0 V, VCONT2 = +3 V, f = 2 GHz Off chip DC blocking capacitors value; 51 pF, Using NEC standard evaluation board
IN
ZO = 50
51 pF VCONT2 1000 pF 4 6 1000 pF VCONT1
3 51 pF OUT2 ZO = 50
1 51 pF OUT1 ZO = 50
6 PIN MINI-MOLD PACKAGE DIMENSIONS (UNIT: mm)
0.3 -0.0
+0.1
0.13 0.1
1
2
3
2.8 -0.3
+0.2
1.5 -0.1
+0.2
0 to 0.1 6 5 0.95 4 0.95 0.8 1.1 -0.1
+0.2
1.9 2.9 0.2
6
PPG152TA
TRUTH TABLE OF SWITCHING BY CONDITION OF CONTROL VOLTAGE
VCONT1 +3 V 0V
OUT1
+3 V
OUT1 IN OUT2
IN OUT2
VCONT2
OUT1
0V
OUT1 IN OUT2
IN OUT2
EVALUATION BOARD
UPG152TA
0.4 mm thickness teflon glass OUT2
OUT1
VCONT1
VCONT2
RF IN
7
PPG152TA
RECOMMENDED SOLDERING CONDITIONS
This Product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives.
Recommended condition symbol IR35-00-3
Soldering process Infrared ray reflow
Soldering conditions Package peak temperature: 235 C Hour: within 30 s. (more than 210 C) Note Time: 3 times, Limited days: no. Package peak temperature: 215 C Hour: within 40 s. (more than 200 C) Note Time: 3 times, Limited days: no. Soldering tub temperature: less than 260 C, Hour: within 10 s. Note Time: 1 time, Limited days: no. Pin area temperature: less than 300 C, Hour: within 3 s. Note Limited days: no.
VPS
VP15-00-3
Wave Soldering
WS60-00-1
Pin part heating
Note It is the storage days after opening a dry pack, the storage conditions are 25 C, less than 65 %, RH. Caution The combined use of soldering method is to be avoided (However, except the pin area heating method). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
8
PPG152TA
[MEMO]
9
PPG152TA
[MEMO]
10
PPG152TA
[MEMO]
11
PPG152TA
Caution
The Great Care must be taken in dealing with the devices in this guide. The reason is that the material of the devices is GaAs (Gallium Arsenide), which is designated as harmful substance according to the law concerned. Keep the law concerned and so on, especially in case of removal.
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product.
M4 96. 5

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